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Localized electrochemical deposition of porous Cu-Ni microcolumns: insights into the growth mechanisms and the mechanical performance
Pellicer Vilà, Eva M. (Universitat Autònoma de Barcelona. Departament de Física)
Suriñach, Santiago (Suriñach Cornet) (Universitat Autònoma de Barcelona. Departament de Física)

Data: 2012
Resum: Cu-rich Cu-Ni alloy microcolumns (11-35 at% Ni) with large porosity degree were grown by localized electrochemical deposition (LECD) at voltages of 6. 5 and 7. 0 V. In turn, conventional electrodeposition was used to deposit fully-compact Cu-Ni films with analogous Ni/Cu ratios from a similar citrate-containing electrolytic solution. The localized supply rate of the predominant Cu(II) and Ni(II) electroactive species in the LECD microregion was calculated assuming both large and small concentration gradients. A shortage of Cu(II) at the cathode surface is mainly responsible for the development of porosity in the microcolumns, which directly affects mechanical performance, specifically nanoindentation hardness and Young’s modulus. From nanoindentation experiments, a relative microcolumn density ranging between 14 and 20% was determined. These values indicate the current efficiency of the LECD process and can be used to calculate the consumption rates associated with metal cation electroreduction.
Drets: Tots els drets reservats
Llengua: Anglès
Document: article ; recerca ; publishedVersion
Matèria: Electroquímica ; Nanoestructures
Publicat a: International journal of electrochemical science, Vol. 7, Núm. 5 (2012) , p. 4014-4029, ISSN 1452-3981

16 p, 1.1 MB

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Documents de recerca > Documents dels grups de recerca de la UAB > Centres i grups de recerca (producció científica) > Ciències > Grup de nanoenginyeria de materials, nanomagnetisme i nanomecànica (Gnm3)
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 Registre creat el 2013-06-07, darrera modificació el 2016-06-05

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