748fd9ac6f6c1652297357ed3b3060c0 pmc_33114151.pdf 94400d6b1848d415805a189c5f1b3321ff7fffc2 pmc_33114151.pdf 027eba51d7892224e2a269e0ee33184f47aa194b71e47978612150632f32c905 pmc_33114151.pdf Title: Resonant MEMS Pressure Sensor in 180 nm CMOS Technology Obtained by BEOL Isotropic Etching Subject: This work presents the design and characterization of a resonant CMOS-MEMS pressure sensor manufactured in a standard 180 nm CMOS industry-compatible technology. The device consists of aluminum square plates attached together by means of tungsten vias integrated into the back end of line (BEOL) of the CMOS process. Three prototypes were designed and the structural characteristics were varied, particularly mass and thickness, which are directly related to the resonance frequency, quality factor, and pressure; while the same geometry at the frontal level, as well as the air gap, were maintained to allow structural comparative analysis of the structures. The devices were released through an isotropic wet etching step performed in-house after the CMOS die manufacturing, and characterized in terms of Q-factor vs. pressure, resonant frequency, and drift vs. temperature and biasing voltage. Keywords: BEOL; CMOS; MEMS; resonator; etching; resonance; quality factor; pressure sensor Author: Diana Mata-Hernandez, Daniel Fernández, Saoni Banerji and Jordi Madrenas Creator: LaTeX with hyperref package Producer: pdfTeX-1.40.18 CreationDate: Thu Oct 29 05:16:47 2020 CET ModDate: Fri Oct 30 09:58:34 2020 CET Tagged: no UserProperties: no Suspects: no Form: none JavaScript: no Pages: 14 Encrypted: no Page size: 595.276 x 841.89 pts (A4) Page rot: 0 File size: 5913282 bytes Optimized: no PDF version: 1.7 name type encoding emb sub uni object ID ------------------------------------ ----------------- ---------------- --- --- --- --------- SWJMSY+URWPalladioL-Ital Type 1 Custom yes yes no 10 0 VIXVIF+URWPalladioL-Bold Type 1 Custom yes yes no 15 0 LJRJBW+URWPalladioL-Roma Type 1 Custom yes yes no 19 0 RVSEMT+TimesNewRomanPS-BoldItalicMT Type 1C WinAnsi yes yes no 27 0 MCBCCI+SourceSansRoman-Regular Type 1C Custom yes yes no 45 0 MCBCCM+SourceSansRoman.613wght Type 1C Custom yes yes no 49 0 MCBCCO+SourceSansRoman-Bold Type 1C Custom yes yes no 53 0 OVNEXW+EURM10 Type 1 Builtin yes yes no 60 0 UGLVDQ+PazoMath-Italic Type 1 Builtin yes yes no 67 0 SYFPBV+CMMI10 Type 1 Builtin yes yes no 71 0 ZBYXGI+CMSY10 Type 1 Builtin yes yes no 75 0 FTWHAS+PazoMath Type 1 Builtin yes yes no 86 0 GIGFZE+CMR10 Type 1 Builtin yes yes no 90 0 XIHCTE+DejaVuSans TrueType WinAnsi yes yes yes 97 0 SUEWWJ+DejaVuSans TrueType WinAnsi yes yes yes 125 0 [none] Type 3 Custom yes no no 135 0 OGJVZM+ArialMT TrueType WinAnsi yes yes yes 138 0 RLANOY+DejaVuSans TrueType WinAnsi yes yes yes 146 0 MWCQGB+f-0-0 Type 1C WinAnsi yes yes no 150 0 JFWYSM+DejaVuSans TrueType WinAnsi yes yes yes 159 0 GVAMLA+DejaVuSans TrueType WinAnsi yes yes yes 169 0 BAHPGX+ArialMT TrueType WinAnsi yes yes yes 173 0 XIRVNA+EURB10 Type 1 Builtin yes yes no 181 0 WEIJUK+CMSY9 Type 1 Builtin yes yes no 191 0 Jhove (Rel. 1.22.1, 2019-04-17) Date: 2022-04-06 02:40:44 CEST RepresentationInformation: pmc_33114151.pdf ReportingModule: PDF-hul, Rel. 1.12.1 (2019-04-17) LastModified: 2020-11-16 03:38:11 CET Size: 5913282 Format: PDF Version: 1.7 Status: Well-Formed and valid SignatureMatches: PDF-hul MIMEtype: application/pdf PDFMetadata: Objects: 356 FreeObjects: 1 IncrementalUpdates: 0 DocumentCatalog: PageLayout: SinglePage PageMode: UseNone Outlines: Item: Title: Introduction Destination: edu.harvard.hul.ois.jhove.module.pdf.PdfSimpleObject@13c27452 Item: Title: Design Considerations Destination: edu.harvard.hul.ois.jhove.module.pdf.PdfSimpleObject@262b2c86 Children: Item: Title: Manufacturing Process Destination: edu.harvard.hul.ois.jhove.module.pdf.PdfSimpleObject@371a67ec Item: Title: Prototype Working Principle Destination: edu.harvard.hul.ois.jhove.module.pdf.PdfSimpleObject@5ed828d Item: Title: System Model Destination: edu.harvard.hul.ois.jhove.module.pdf.PdfSimpleObject@50d0686 Item: Title: Prototype Design Destination: edu.harvard.hul.ois.jhove.module.pdf.PdfSimpleObject@7a3d45bd Children: Item: Title: Prototype A Destination: edu.harvard.hul.ois.jhove.module.pdf.PdfSimpleObject@1e7c7811 Item: Title: Prototype B Destination: edu.harvard.hul.ois.jhove.module.pdf.PdfSimpleObject@77ec78b9 Item: Title: Prototype C Destination: edu.harvard.hul.ois.jhove.module.pdf.PdfSimpleObject@1a3869f4 Item: Title: Release of the Pressure Sensor Prototypes Destination: edu.harvard.hul.ois.jhove.module.pdf.PdfSimpleObject@a38d7a3 Item: Title: Experimental Results Destination: edu.harvard.hul.ois.jhove.module.pdf.PdfSimpleObject@77f99a05 Children: Item: Title: Experimental Setup Destination: edu.harvard.hul.ois.jhove.module.pdf.PdfSimpleObject@63440df3 Item: Title: Resonance Frequencies of the Prototypes Destination: edu.harvard.hul.ois.jhove.module.pdf.PdfSimpleObject@3aeaafa6 Item: Title: Pressure Measurements Destination: edu.harvard.hul.ois.jhove.module.pdf.PdfSimpleObject@76a3e297 Item: Title: Temperature-Drift Measurements Destination: edu.harvard.hul.ois.jhove.module.pdf.PdfSimpleObject@4d3167f4 Item: Title: Conclusions Destination: edu.harvard.hul.ois.jhove.module.pdf.PdfSimpleObject@ed9d034 Item: Title: References Destination: edu.harvard.hul.ois.jhove.module.pdf.PdfSimpleObject@6121c9d6 Info: Title: Resonant MEMS Pressure Sensor in 180 nm CMOS Technology Obtained by BEOL Isotropic Etching Author: Diana Mata-Hernandez, Daniel Fernández, Saoni Banerji and Jordi Madrenas Subject: This work presents the design and characterization of a resonant CMOS-MEMS pressure sensor manufactured in a standard 180 nm CMOS industry-compatible technology. The device consists of aluminum square plates attached together by means of tungsten vias integrated into the back end of line (BEOL) of the CMOS process. Three prototypes were designed and the structural characteristics were varied, particularly mass and thickness, which are directly related to the resonance frequency, quality factor, and pressure; while the same geometry at the frontal level, as well as the air gap, were maintained to allow structural comparative analysis of the structures. The devices were released through an isotropic wet etching step performed in-house after the CMOS die manufacturing, and characterized in terms of Q-factor vs. pressure, resonant frequency, and drift vs. temperature and biasing voltage. 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