Sputtering process takes place as the inert gas molecules bombard high-energy electrons, generating the +ion s that accelerate towards the film material. That causes the atoms or the molecules (-10eV) to sputter and a part of them intercepted by the substrate is deposited in a form of a thin layer. Since the active molecules are that of high-energy, they tend to migrate and diffuse on the substrate surface and go deep into the substrate phase. But no change or destroy of the original surface structure will occur. Therefore, this deposition technique is clean, highly refined and pragmatic, which features good quality film.