Enhancement of thermal boundary conductance of metal-polymer system
Sandell, Susanne (Norwegian University of Science and Technology. Department of Structural Engineering)
Maire, Jeremie (Institut Català de Nanociència i Nanotecnologia)
Chávez Ángel, Emigdio (Institut Català de Nanociència i Nanotecnologia)
Sotomayor Torres, Clivia M. (Institut Català de Nanociència i Nanotecnologia)
Kristiansen, Helge (Norwegian University of Science and Technology. Department of Structural Engineering)
Zhang, Zhiliang (Norwegian University of Science and Technology. Department of Structural Engineering)
He, Jianying (Norwegian University of Science and Technology. Department of Structural Engineering)

Data:	2020
Resum:	In organic electronics, thermal management is a challenge, as most organic materials conduct heat poorly. As these devices become smaller, thermal transport is increasingly limited by organic-inorganic interfaces, for example that between a metal and a polymer. However, the mechanisms of heat transport at these interfaces are not well understood. In this work, we compare three types of metal-polymer interfaces. Polymethyl methacrylate (PMMA) films of different thicknesses (1-15 nm) were spin-coated on silicon substrates and covered with an 80 nm gold film either directly, or over an interface layer of 2 nm of an adhesion promoting metal-either titanium or nickel. We use the frequency-domain thermoreflectance (FDTR) technique to measure the effective thermal conductivity of the polymer film and then extract the metal-polymer thermal boundary conductance (TBC) with a thermal resistance circuit model. We found that the titanium layer increased the TBC by a factor of 2, from 59 × 10 W·m·K to 115 × 10 W·m·K, while the nickel layer increased TBC to 139 × 10 W·m·K. These results shed light on possible strategies to improve heat transport in organic electronic systems.
Ajuts:	Ministerio de Economía y Competitividad SEV-2017-0706 Ministerio de Ciencia e Innovación PGC2018-101743-B-I00
Drets:	Aquest document està subjecte a una llicència d'ús Creative Commons. Es permet la reproducció total o parcial, la distribució, la comunicació pública de l'obra i la creació d'obres derivades, fins i tot amb finalitats comercials, sempre i quan es reconegui l'autoria de l'obra original.
Llengua:	Anglès
Document:	Article ; recerca ; Versió publicada
Matèria:	Adhesion layer ; Enhancement of thermal boundary conductance ; Organic electronics ; Thermal characterization of polymer ; Thermal conductivity of polymer thin films
Publicat a:	Nanomaterials, Vol. 10, issue 4 (April 2020) , art. 670, ISSN 2079-4991

DOI: 10.3390/nano10040670
PMID: 32252435

11 p, 1.5 MB

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