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Research literature, 1 records found
Research literature 1 records found  
1.
206 p, 7.0 MB Evaluation of die attach materials for high temperature power electronics appictions and analysis of the Ag particles sintering solution / Navarro Melchor, Luis Alberto ; Jorda Sanuy, Xavier, dir. ; Perpiña, Xavier, dir. ; Abadal Berini, Gabriel, tutor (Universitat Autònoma de Barcelona. Departament d'Enginyeria Electrònica) ; Universitat Autònoma de Barcelona. Departament d'Enginyeria Electrònica
Sintering of Ag particles is an interesting solution as die-attach material for power electronics packaging in high temperature applications because it offers the outstanding properties of Ag (including a 961 ºC melting point) using low process temperature ( 300 ºC). [...]
La sinterización de partículas de Ag es una solución interesante como material para die-attach para los módulos de la electrónica de potencia principalmente en aplicaciones de alta temperatura, ya que ofrece las propiedades sobresalientes de la Ag (incluyendo punto de fusión de 961 ºC) usando una baja temperatura de proceso ( 300 ºC). [...]
Sintering of Ag particles is an interesting solution as die-attach material for power electronics packaging in high temperature applications because it offers the outstanding properties of Ag (including a 961 ºC melting point) using low process temperature ( 300 ºC). [...]

[Barcelona] : Universitat Autònoma de Barcelona, 2015  

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