Results overview: Found 3 records in 0.03 seconds.
Research literature, 3 records found
Research literature 3 records found  
1.
285 p, 14.1 MB Advanced analysis of microelectronic devices and systems by lock-in IR thermography / León Cerro, Javier ; Perpiñà Giribet, Xavier, dir. ; Vellvehi Hernández, Miquel, dir. ; Abadal Berini, Gabriel, dir. (Universitat Autònoma de Barcelona. Departament d'Enginyeria Electrònica) ; Universitat Autònoma de Barcelona. Departament d'Enginyeria Electrònica
Desde los inicios de la revolución microelectrónica, su evolución tecnológica siempre se ha visto marcada por la búsqueda constante de dispositivos y sistemas electrónicos monolíticos más compactos, fiables y robustos, ofreciendo mejores prestaciones y funcionalidades a un coste razonable. [...]
Since the microelectronic revolution, its technological evolution has been aimed at searching for more compact, reliable, and rugged electronic devices or integrated systems, offering as much performances and functionalities as possible at a lower cost. [...]

[Barcelona] : Universitat Autònoma de Barcelona, 2016  
2.
206 p, 7.0 MB Evaluation of die attach materials for high temperature power electronics appictions and analysis of the Ag particles sintering solution / Navarro Melchor, Luis Alberto ; Jorda Sanuy, Xavier, dir. ; Perpiña, Xavier, dir. ; Abadal Berini, Gabriel, tutor (Universitat Autònoma de Barcelona. Departament d'Enginyeria Electrònica) ; Universitat Autònoma de Barcelona. Departament d'Enginyeria Electrònica
Sintering of Ag particles is an interesting solution as die-attach material for power electronics packaging in high temperature applications because it offers the outstanding properties of Ag (including a 961 ºC melting point) using low process temperature ( 300 ºC). [...]
La sinterización de partículas de Ag es una solución interesante como material para die-attach para los módulos de la electrónica de potencia principalmente en aplicaciones de alta temperatura, ya que ofrece las propiedades sobresalientes de la Ag (incluyendo punto de fusión de 961 ºC) usando una baja temperatura de proceso ( 300 ºC). [...]
Sintering of Ag particles is an interesting solution as die-attach material for power electronics packaging in high temperature applications because it offers the outstanding properties of Ag (including a 961 ºC melting point) using low process temperature ( 300 ºC). [...]

[Barcelona] : Universitat Autònoma de Barcelona, 2015  
3.
143 p, 3.3 MB Internal IR-laser deflection measurements of temperature and free-carrier concentration in power devices / Perpiñá Giribet, Xavier ; Jordà i Sanuy, Xavier, dir. (Centro Nacional de Microelectrónica) ; Mestres i Andreu, Narcís, dir. (Institut de Ciència de Materials de Barcelona)
La caracterització dels dispositius semiconductors té un paper preponderant dintre la microelectrònica, sobretot en els dipositius semiconductors de potència, on la caracterització electrotèrmica és primordial. [...]
The characterisation of semiconductor devices has an important role in Microelectronics; especially in the case of power semiconductor devices, where the thermo-electrical characterisation is an essential aspect to study their behaviour. [...]

Bellaterra : Universitat Autònoma de Barcelona, 2006  

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1 Perpiña, Xavier,
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