Results overview: Found 4 records in 0.03 seconds.
Articles, 4 records found
Articles 4 records found  
1.
5 p, 494.4 KB Oxide Breakdown Spot Spatial Patterns as Fingerprints for Optical Physical Unclonable Functions / Porti i Pujal, Marc (Universitat Autònoma de Barcelona. Departament d'Enginyeria Electrònica) ; Redon, Miquel (Universitat Autònoma de Barcelona. Departament d'Enginyeria Electrònica) ; Muñoz Gorriz, Jordi (Universitat Autònoma de Barcelona. Departament d'Enginyeria Electrònica) ; Nafría i Maqueda, Montserrat (Universitat Autònoma de Barcelona. Departament d'Enginyeria Electrònica) ; Miranda, Enrique (Universitat Autònoma de Barcelona. Departament d'Enginyeria Electrònica)
Dielectric Breakdown (BD) of the gate oxide in a Metal-Insulator-Semiconductor (MIS) or Metal-Insulator-Metal (MIM) structure has been traditionally considered a major drawback since such event can seriously affect the electrical performance of the circuit containing the device. [...]
2023 - 10.1109/LED.2023.3301974
IEEE electron device letters, Vol. 44, Issue 10 (October 2023) , p. 1600-1603  
2.
5 p, 691.3 KB DC characterization and fast small-signal parameter extraction of organic thin film transistors with different geometries / Nafría i Maqueda, Montserrat (Universitat Autònoma de Barcelona. Departament d'Enginyeria Electrònica) ; Crespo Yepes, Albert (Universitat Autònoma de Barcelona. Departament d'Enginyeria Electrònica) ; Rodríguez Martínez, Rosana (Universitat Autònoma de Barcelona. Departament d'Enginyeria Electrònica) ; Arnal, August (Institut de Microelectrònica de Barcelona) ; Ramon, Eloi (Institut de Microelectrònica de Barcelona) ; Terés Terés, Lluís (Institut de Microelectrònica de Barcelona)
Organic Devices offer low-cost manufacturing and better flexibility, sustainability and solution-processability than their Si-based MOS counterparts, which make them suitable for new applications where those characteristics are an advantage. [...]
2020 - 10.1109/LED.2020.3021236
IEEE electron device letters, Vol. 41, Issue 10 (October 2020) , p. 1512-1515  
3.
7 p, 2.6 MB A First Evaluation of Thick Oxide 3C-SiC MOS Capacitors Reliability / Li, Fan (University of Warwick) ; Mawby, Philip A. (University of Warwick) ; Song, Qiu (University of Warwick) ; Perez-Tomas, Amador (Institut Català de Nanociència i Nanotecnologia) ; Shah, Vishal (University of Warwick) ; Sharma, Yogesh (Dynex Semiconductor Ltd.) ; Hamilton, Dean P. (De Montfort University) ; Fisher, Craig (University of Warwick) ; Gammon, Peter (University of Warwick) ; Jennings, M. R. (Swansea University)
Despite the recent advances in 3C-SiC technology, there is a lack of statistical analysis on the reliability of SiO layers on 3C-SiC, which is crucial in power MOS device developments. This article presents a comprehensive study of the medium-and long-term time-dependent dielectric breakdowns (TDDBs) of 65-nm-thick SiO layers thermally grown on a state-of-the-art 3C-SiC/Si wafer. [...]
2020 - 10.1109/TED.2019.2954911
IEEE transactions on electron devices, Vol. 67, Issue 1 (January 2020) , p. 237-242  
4.
15 p, 1.3 MB High-Temperature Electrical and Thermal Aging Performance and Application Considerations for SiC Power DMOSFETs / Hamilton, Dean P. (University of Warwick) ; Jennings, M. R. (University of Warwick) ; Perez-Tomas, Amador (Institut Català de Nanociència i Nanotecnologia) ; Russell, Stephen A. O. (University of Warwick) ; Hindmarsh, Steven A. (University of Warwick) ; Fisher, C. A. (University of Warwick) ; Mawby, Philip A. (University of Warwick)
The temperature dependence and stability of three different commercially-available unpackaged SiC Dmosfets have been measured. On-state resistances increased to 6 or 7 times their room temperature values at 350 °C. [...]
2017 - 10.1109/TPEL.2016.2636743
IEEE transactions on power electronics, Vol. 32, Issue 10 (October 2017) , p. 7967-7979  

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