Enhancement of thermal boundary conductance of metal-polymer system
Sandell, Susanne ![ORCID Identifier](/img/uab/orcid.ico)
(Norwegian University of Science and Technology. Department of Structural Engineering)
Maire, Jeremie ![ORCID Identifier](/img/uab/orcid.ico)
(Institut Català de Nanociència i Nanotecnologia)
Chávez Ángel, Emigdio ![ORCID Identifier](/img/uab/orcid.ico)
(Institut Català de Nanociència i Nanotecnologia)
Sotomayor Torres, Clivia M. ![ORCID Identifier](/img/uab/orcid.ico)
(Institut Català de Nanociència i Nanotecnologia)
Kristiansen, Helge (Norwegian University of Science and Technology. Department of Structural Engineering)
Zhang, Zhiliang ![ORCID Identifier](/img/uab/orcid.ico)
(Norwegian University of Science and Technology. Department of Structural Engineering)
He, Jianying
(Norwegian University of Science and Technology. Department of Structural Engineering)
Date: |
2020 |
Abstract: |
In organic electronics, thermal management is a challenge, as most organic materials conduct heat poorly. As these devices become smaller, thermal transport is increasingly limited by organic-inorganic interfaces, for example that between a metal and a polymer. However, the mechanisms of heat transport at these interfaces are not well understood. In this work, we compare three types of metal-polymer interfaces. Polymethyl methacrylate (PMMA) films of different thicknesses (1-15 nm) were spin-coated on silicon substrates and covered with an 80 nm gold film either directly, or over an interface layer of 2 nm of an adhesion promoting metal-either titanium or nickel. We use the frequency-domain thermoreflectance (FDTR) technique to measure the effective thermal conductivity of the polymer film and then extract the metal-polymer thermal boundary conductance (TBC) with a thermal resistance circuit model. We found that the titanium layer increased the TBC by a factor of 2, from 59 × 10 W·m·K to 115 × 10 W·m·K, while the nickel layer increased TBC to 139 × 10 W·m·K. These results shed light on possible strategies to improve heat transport in organic electronic systems. |
Grants: |
Ministerio de Economía y Competitividad SEV-2017-0706 Ministerio de Ciencia e Innovación PGC2018-101743-B-I00
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Rights: |
Aquest document està subjecte a una llicència d'ús Creative Commons. Es permet la reproducció total o parcial, la distribució, la comunicació pública de l'obra i la creació d'obres derivades, fins i tot amb finalitats comercials, sempre i quan es reconegui l'autoria de l'obra original. ![Creative Commons](/img/licenses/by.ico) |
Language: |
Anglès |
Document: |
Article ; recerca ; Versió publicada |
Subject: |
Adhesion layer ;
Enhancement of thermal boundary conductance ;
Organic electronics ;
Thermal characterization of polymer ;
Thermal conductivity of polymer thin films |
Published in: |
Nanomaterials, Vol. 10, issue 4 (April 2020) , art. 670, ISSN 2079-4991 |
DOI: 10.3390/nano10040670
PMID: 32252435
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Record created 2020-11-18, last modified 2022-09-10