Towards wafer-scale 2D material sensors
Steeneken, Peter G. (Delft University of Technology. Department of Precision and Microsystems Engineering)
Soikkeli, Miika (VTT Technical Research Centre of Finland Ltd)
Arpiainen, Sanna (Infineon Technologies AG)
Rantala, Arto (VTT Technical Research Centre of Finland Ltd)
Jaaniso, Raivo (University of Tartu. Institute of Physics)
Pezone, Roberto (Delft University of Technology. Microelectronics Department)
Vollebregt, Sten (Delft University of Technology. Microelectronics Department)
Lukas, Sebastian (RWTH Aachen University)
Kataria, Satender (Advanced Microelectronic Center Aachen. AMO GmbH)
Houmes, Maurits J. A. (Delft University of Technology. Kavli Institute of Nanoscience)
Álvarez Diduk, Ruslan (Institut Català de Nanociència i Nanotecnologia)
Lee, Kangho (University of the Bundeswehr Munich. Institute of Physics)
Suryo Wasisto, Hutomo (Infineon Technologies AG)
Anzinger, Sebastian (Infineon Technologies AG)
Fueldner, Marc (Infineon Technologies AG)
Verbiest, Gerard J. (Delft University of Technology. Department of Precision and Microsystems Engineering)
Alijani, Farbod (Delft University of Technology. Department of Precision and Microsystems Engineering)
Hoon Shin, Dong (Korea University. Department of Electronics and Information Engineering)
Malic, Ermin (Philipps-Universität Marburg. Department of Physics)
van Rijn, Richard (Applied Nanolayers B.V.)
Nevanen, Tarja K. (VTT Technical Research Centre of Finland Ltd)
Centeno, Alba (Graphenea)
Zurutuza, Amaia (Graphenea)
van der Zant, Herre S. J. (Delft University of Technology. Kavli Institute of Nanoscience)
Merkoçi, Arben (Institut Català de Nanociència i Nanotecnologia)
Duesberg, Georg S. (University of the Bundeswehr Munich. Institute of Physics)
Lemme, Max C. (Advanced Microelectronic Center Aachen. AMO GmbH)

Date:	2025
Abstract:	The unique properties of two-dimensional (2D) materials bring great promise to improve sensor performance and realise novel sensing principles. However, to enable their high-volume production, wafer-scale processes that allow integration with electronic readout circuits need to be developed. In this perspective, we review recent progress in on-chip 2D material sensors, and compare their performance to the state-of-the-art, with a focus on results achieved in the Graphene Flagship programme. We discuss transfer-based and transfer-free production flows and routes for complementary metal-oxide-semiconductor integration and prototype development. Finally, we give an outlook on the future of 2D material sensors, and sketch a roadmap towards realising their industrial and societal impact.
Grants:	European Commission 881603 Agencia Estatal de Investigación CEX2021-001214-S
Rights:	Aquest document està subjecte a una llicència d'ús Creative Commons. Es permet la reproducció total o parcial, la distribució, la comunicació pública de l'obra i la creació d'obres derivades, fins i tot amb finalitats comercials, sempre i quan es reconegui l'autoria de l'obra original.
Language:	Anglès
Document:	Article ; recerca ; Versió publicada
Subject:	2D materials ; Sensor ; Graphene ; NEMS ; MEMS ; Waferscale ; CMOS
Published in:	2D materials, Vol. 12, Issue 2 (April 2025) , art. 23002, ISSN 2053-1583

DOI: 10.1088/2053-1583/adac73

12 p, 1.7 MB

The record appears in these collections:
Research literature > UAB research groups literature > Research Centres and Groups (research output) > Experimental sciences > Catalan Institute of Nanoscience and Nanotechnology (ICN2)
Articles > Research articles
Articles > Published articles