Web of Science: 42 cites, Scopus: 43 cites, Google Scholar: cites
A comparison between fine-grained and nanocrystalline electrodeposited Cu-Ni films. Insights on mechanical and corrosion performance
Pellicer Vilà, Eva M. (Eva Maria) (Universitat Autònoma de Barcelona. Departament de Física)
Suriñach, Santiago (Suriñach Cornet) (Universitat Autònoma de Barcelona. Departament de Física)
Varea Espelt, Aïda (Universitat Autònoma de Barcelona. Departament de Física)
Pané i Vidal, Salvador (Institute of Robotics and Intelligent Systems)
Sivaraman, K.M. (Institute of Robotics and Intelligent Systems)
Nelson, Bradley J. (Institute of Robotics and Intelligent Systems)
Baró, M. D. (Universitat Autònoma de Barcelona. Departament de Física)
Sort Viñas, Jordi (Universitat Autònoma de Barcelona. Departament de Física)

Data: 2011
Resum: Cu1−x-Nix (0. 43 ≤ x ≤ 1. 0) films were electrodeposited from citrate-sulphate baths at different current densities onto Cu/Ti/Si (100) substrates with the addition of saccharine as a grain-refining agent. The Cu-Ni alloy films produced from saccharine-free baths were fine-grained (crystallite size of ~400 nm). The addition of saccharine to the electrolytic solution induced a dramatic decrease in crystal size (down to ~27 nm) along with a reduction in surface roughness. Although the effect of saccharine on pure Ni films was less obvious, significant changes were observed due to the presence of saccharine in the bath during the alloying of Cu with Ni. Compared to fine-grained Cu-Ni films, the nanocrystalline films exhibited lower microstrains and a larger amount of stacking faults as observed by X-ray diffraction. These features enhance the mechanical properties of the Cu-Ni alloys, making the nanocrystalline Cu-Ni films superior to both the corresponding fine-grained films and pure Ni films. In particular, hardness in fine-grained films varied from 4. 2 (x=0. 43) to 5. 4 GPa (x=0. 86), whereas hardness varied between 6. 7 and 8. 2 GPa for nanocrystalline films of similar composition. In addition, wear resistance and elastic recovery were enhanced. Nanostructuring did not significantly affect corrosion resistance of Cu-Ni alloys in chloride media. Although the corrosion potential shifted slightly towards more negative values, the corrosion current density decreased, thereby making the electrodeposition nanostructuring process an effective tool to improve the overall properties of the Cu-Ni system.
Ajuts: Ministerio de Economía y Competitividad MAT2011-27380-C02-01
Agència de Gestió d'Ajuts Universitaris i de Recerca 2009/SGR-1292
Nota: This is the author's version of a work that was accepted for publication in Surface & coating technology. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Surface & coating technology, Vol. 205, Núm. 23-24 (Sep 2011), p. 2585-5293 DOI 10.1016/j.surfcoat.2011.05.047
Drets: Tots els drets reservats
Llengua: Anglès
Document: Article ; recerca ; Versió acceptada per publicar
Matèria: Electroformació ; Nanocristalls ; Coure -- Compostos ; Níquel -- Compostos
Publicat a: Surface and coatings technology, Vol. 205, Núm. 23-24 (Sep 2011) , p. 2585-5293, ISSN 0257-8972

DOI: 10.1016/j.surfcoat.2011.05.047

11 p, 1.8 MB

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Documents de recerca > Documents dels grups de recerca de la UAB > Centres i grups de recerca (producció científica) > Ciències > Grup de nanoenginyeria de materials, nanomagnetisme i nanomecànica (Gnm3)
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