Challenges and solutions to the defect-centric modeling and circuit simulation of time-dependent variability
Martin Martinez, Javier (Universitat Autònoma de Barcelona. Departament d'Enginyeria Electrònica)
Diaz-Fortuny, Javier (Universitat Autònoma de Barcelona. Departament d'Enginyeria Electrònica)
Saraza-Canflanca, Pablo (Instituto de Microelectrónica de Sevilla)
Rodríguez Martínez, Rosana (Universitat Autònoma de Barcelona. Departament d'Enginyeria Electrònica)
Castro-Lopez, Rafael (Instituto de Microelectrónica de Sevilla)
Roca, Elisenda (Instituto de Microelectrónica de Sevilla)
Fernandez, Francisco V. (Instituto de Microelectrónica de Sevilla)
Nafría i Maqueda, Montserrat (Universitat Autònoma de Barcelona. Departament d'Enginyeria Electrònica)

Publicación:	Institute of Electrical and Electronics Engineers Inc., 2023
Descripción:	9 pàg.
Resumen:	Time-Dependent Variability (TDV) phenomena represent a serious concern for device and circuit reliability. To address the TDV impact at circuit level, Reliability-Aware Design (RAD) tools can be used by circuit designers to achieve more reliable circuits. However, this is not a straightforward task, since the development of RAD tools comprises several steps such as the characterization, modeling and simulation of TDV phenomena. Furthermore, in deeply-scaled CMOS technologies, TDV reveals a stochastic nature that can complicate those steps. In this invited paper, we review some of the main challenges that appear in each step of the flow towards the development of RAD tools, providing our solutions to them.
Ayudas:	Agencia Estatal de Investigación PID2019-103869RB-C32 Agencia Estatal de Investigación PID2019-103869RB-C31
Derechos:	Tots els drets reservats.
Lengua:	Anglès
Documento:	Capítol de llibre ; recerca ; Versió acceptada per publicar
Materia:	Aging ; Array ; Bias Temperature Instability (BTI) ; Characterization ; CMOS ; Degradation ; Hot Carrier Injection (HCI) ; Random Telegraph Noise (RTN) ; Reliability ; Reliability-Aware Design (RAD) ; Variability
Publicado en:	IEEE International Reliability Physics Symposium (IRPS) Proceedings, 2023, ISBN 978-1-6654-5672-2

DOI: 10.1109/irps48203.2023.10118334

Disponible a partir de: 2025-12-30 Postprint

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Libros y colecciones > Capítulos de libros