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3C-SiC Transistor with Ohmic Contacts Defined at Room Temperature
Li, Fan (University of Warwick)
Sharma, Yogesh (University of Warwick)
Walker, David (University of Warwick)
Hindmarsh, Steven A. (University of Warwick)
Jennings, Mike (University of Warwick)
Martin, David (University of Warwick)
Fisher, Craig (University of Warwick)
Gammon, Peter (University of Warwick)
Perez-Tomas, Amador (Institut Català de Nanociència i Nanotecnologia)
Mawby, Phil (University of Warwick)

Date: 2016
Abstract: Among all SiC polytypes, only 3C-SiC has a cubic structure and can be hetero-epitaxial grown on large area Si substrate, thus providing an alternative choice for fabricating cheap wide bandgap power devices. Here, we present a low resistivity (~3 × 10Ω cm) ohmic contact formed by directly depositing a Ti/Ni metal stack on n-type 3C-SiC without any extra annealing. For the first time, 3C-SiC lateral MOSFETs with asdeposited ohmic contacts were fabricated, and it turned out not only the ohmic contact is free from any interface voids, but also a higher field-effect mobility value (~80 cm/V · s) was achieved compared with the annealed devices.
Rights: Tots els drets reservats.
Language: Anglès
Document: Article ; recerca ; Versió acceptada per publicar
Subject: 3C-SiC ; Channel mobility ; MOSFET ; Ohmic contact ; Reliability
Published in: IEEE electron device letters, Vol. 37, Issue 9 (September 2016) , p. 1189-1192, ISSN 0741-3106

DOI: 10.1109/LED.2016.2593771


Postprint
5 p, 602.1 KB

The record appears in these collections:
Research literature > UAB research groups literature > Research Centres and Groups (research output) > Experimental sciences > Catalan Institute of Nanoscience and Nanotechnology (ICN2)
Articles > Research articles
Articles > Published articles

 Record created 2019-03-01, last modified 2022-09-12



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